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Broadcom

370.34
+1.550.42%
Pre-market: 367.87-2.4700-0.67%04:26 EDT
Volume:21.95M
Turnover:8.12B
Market Cap:1.76T
PE:61.63
High:372.75
Open:369.52
Low:366.30
Close:368.79
52wk High:495.00
52wk Low:287.17
Shares:4.74B
Float Shares:4.67B
Volume Ratio:1.17
T/O Rate:0.47%
Dividend:2.54
Dividend Rate:0.69%
EPS(TTM):6.01
EPS(LYR):4.77
ROE:37.28%
ROA:12.12%
PB:20.02
PE(LYR):77.64

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NVIDIA and Broadcom CPO Switches Begin Small-Scale Shipments, With Optical Engine Yield and Advanced Packaging Capacity as Key Factors

Deep News
·
Jul 27

Premarket Movers|Chip Shares Stage Broad Gains as INTC, ARM Climb Over 3%

Tiger Newspress
·
Jul 27

Nvidia Gains 1.2%, Intel Climbs 2.8%, Broadcom up 2.1%

THOMSON REUTERS
·
Jul 27

Nvidia, Samsung and SK Hynix Set for Mega-Orders as South Korea Finalizes $950 Billion AI Partnership; Lee Jae-myung Bets on AI

TradingKey
·
Jul 27

Broadcom (AVGO) Price Forecast: $389 Resistance, Hyperscaler Earnings This Week

TradingKey
·
Jul 27

Samsung Electronics Signs $200 Billion MOU With Broadcom to Expand AI Chip Partnership

MT Newswires Live
·
Jul 27

South Korea's Memory Chip Giants Poised to Secure $950 Billion Mega-Deal, Industry Recovery May Continue

Stock News
·
Jul 27

Samsung, Broadcom sign MOU for $200B collaboration

TIPRANKS
·
Jul 27

Top Three DRAM ETF Stocks to Watch This Week: Samsung, SK Hynix, Seagate

Benzinga_recent_news
·
Jul 27

Three Positive Catalysts Emerge Over the Weekend, Market Outlook Shifts

Deep News
·
Jul 26

Intel Layoffs, Musk's Micron Moment, $200 Billion Samsung-Broadcom Pact and More: This Week in Tech

Benzinga Earnings
·
Jul 26

Samsung and Broadcom (AVGO) Sign $200 Billion AI Chip Deal Through 2030

TIPRANKS
·
Jul 26

Broadcom’s AI Boom Sparks Huge Hopes—and Valuation Jitters

TIPRANKS
·
Jul 25

US-Korea $940 Billion Semiconductor Alliance Reshapes Global AI Supply Chain Rules

Deep News
·
Jul 25

Samsung Secures $200 Billion Deal to Supply Chips to Broadcom

Deep News
·
Jul 25

Samsung Elec Wins $200 Billion Broadcom AI Chip Partnership, Boosting Foundry Push

Reuters
·
Jul 25

Samsung, Broadcom Sign MOU to Expand Memory and Foundry Collaboration for AI Chips

Reuters
·
Jul 25

Samsung Electronics: Signs Memorandum of Understanding with Broadcom Covering up to $200 Billion Through 2030 Across Memory Chips, Foundry Services and Advanced Packaging

THOMSON REUTERS
·
Jul 25

Samsung Electronics: to Collaborate with Broadcom on Development of Broadcom’s Next-generation AI Accelerators Based on Samsung’s Hbm Technology

THOMSON REUTERS
·
Jul 25

Samsung Elec, Broadcom Sign Mou for Advanced Memory Chip-foundry Deal Worth $20 Bln over 5 Yrs - Media

THOMSON REUTERS
·
Jul 25