Qnity Electronics (Q) introduced its Stackplane family of chemical mechanical planarization, or CMP slurries, the company said Monday.

The Stackplane platform combines commercialized products with next-generation slurry technologies under a unified portfolio designed for advanced packaging applications, Qnity said.

The platform includes slurry technologies engineered for planarization at both the wafer and die levels, it said.

The products include the Stackplane SP1000 and SP2000 series for hybrid bonding, the Stackplane SP3000 series for through-silicon via applications, the Stackplane SP4000 series for polymer CMP, and the Stackplane SP5000 series for emerging technologies, including panel-level through-glass vias and glass CMP.